IC package with heat spreader

An apparatus comprising:

• an integrated circuit (IC) package comprising:
• a molding having a first surface and a second surface, the first surface opposing the second surface;
• an interconnect encased in the molding, the interconnect comprising:
• pads situated at a periphery of a first surface of the IC package, wherein a portion of the pads are exposed at the first surface of the molding;
• and
• a die pad situated proximal to the second surface of the molding, the die pad having a first surface and a second surface, the first surface opposing the second surface, and the second surface is circumscribed by the second surface of the molding;
• a die mounted on the first surface of the die pad;
• a heat spreader mounted on the second surface of the molding and the second surface of the die pad, wherein the heat spreader extends between edges of the second surface of the molding, and the heat spreader provides a second surface of the IC package;
• and
• a printed circuit board (PCB) having traces on a surface of the PCB, at least some of the pads being electrically connected to at least some of the traces.