US 12,009,276 B2Granted

Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same

AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.

InventorsYu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng

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Abstract

A semiconductor package including a lid having one or more heat pipes located on and/or within the lid to provide improved thermal management. A lid for a semiconductor package having one or more heat pipes thermally integrated with the lid may provide more uniform heat loss from the semiconductor package, reduce the risk of damage to the package due to excessive heat accumulation, and may enable the lid to be fabricated using less expensive materials, thereby reducing the costs of a semiconductor package.

Claims20

Dependent claims

A semiconductor package, comprising:

a package substrate;
at least one semiconductor device mounted to the package substrate;
and
a lid attached to the package substrate and extending over the at least one semiconductor device, the lid comprising at least one heat pipe located on or in the lid and extending between a central region of the semiconductor package including a relatively higher density of semiconductor devices and a peripheral region of the semiconductor package including a relatively lower density of semiconductor devices, wherein the at least one heat pipe comprises:
an outer wall enclosing a central fluid conduit;
a working fluid enclosed within the outer wall, wherein a first portion of the working fluid is in a liquid phase and a second portion of the working fluid is in a gas phase at an operating temperature of the semiconductor package;
and
a wick structure enclosed within the outer wall and configured to exert a capillary action on the working fluid that is in a liquid phase.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/407,224Filed 20 Aug 2021
Published: US 2023/0057025 A123 Feb 2023
Granted: 11 Jun 2024
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

H10W 40/226
Characterised by their shape, e.g. having conical or cylindrical projections: characterised by projecting parts, e.g. fins to increase surface area
H10W 40/10
Arrangements for thermal protection or thermal control: arrangements for heating
H10W 40/258
Characterised by their materials: metallic materials
H10W 40/73
Fillings or auxiliary members in containers or in encapsulations for thermal protection or control: for cooling by change of state

Family

US 2023/0057025 A1Pre-grant publication · published 23 Feb 2023
US 12,009,276 B2This patent

From the US filing history. Foreign family members aren’t listed.

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