Semiconductor package including thermal exhaust pathway
AssigneeSamsung Electronics Co., Ltd.
InventorsEungkyu Kim, Kyounglim Suk
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes; a wiring structure including signal wiring and heat transfer wiring, an active chip on the wiring structure, a signal terminal disposed between the wiring structure and the active chip, a first heat transferring terminal disposed between the wiring structure and the active chip and connected to the heat transfer wiring, a passive chip on the wiring structure, a second heat transferring terminal disposed between the wiring structure and the passive chip and connected to the heat transfer wiring, and a heat spreader on the passive chip.
Claims19
A semiconductor package comprising:
- a wiring structure including signal wiring and a heat transfer wiring spaced apart from the signal wiring;
- an active chip on the wiring structure;
- a signal terminal disposed between the wiring structure and the active chip;
- a first heat transferring terminal disposed between the wiring structure and the active chip and connected to the heat transfer wiring;
- a passive chip on the wiring structure;
- a second heat transferring terminal disposed between the wiring structure and the passive chip and connected to the heat transfer wiring;
- and
- a heat spreader on the passive chip,
- wherein the passive chip is an electrically inactive dummy chip, and
- wherein the heat transfer wiring is a single wiring in the wiring structure, and the plurality of first heat transferring terminals and the plurality of second heat transferring terminals are commonly connected to the single wiring.
A semiconductor package comprising:
- a wiring structure including signal wiring and a heat transfer wiring;
- an active chip on the wiring structure and connected to the signal wiring and the heat transfer wiring;
- a passive chip on the wiring structure and connected to the heat transfer wiring;
- and
- a heat spreader on the passive chip,
- wherein the passive chip is an electrically inactive dummy chip, and
- wherein the heat transfer wiring is a single wiring in the wiring structure, and wherein the active chip and the passive chip are commonly connected to the single wiring.
A semiconductor package comprising:
- a redistribution layer including signal wiring and a heat transfer wiring;
- an active chip on the redistribution layer;
- a signal terminal between the redistribution layer and the active chip;
- a first heat transferring terminal between the redistribution layer and the active chip and connected to the heat transfer wiring;
- a passive chip on the redistribution layer;
- a second heat transferring terminal disposed between the redistribution layer and the passive chip and connected to the heat transfer wiring;
- a heat spreader on the passive chip;
- an external terminal on a lower surface of the redistribution layer;
- and
- an encapsulant disposed on the redistribution layer between the active chip and the heat spreader,
- wherein the passive chip is an electrically inactive dummy chip, and
- wherein the heat transfer wiring is a single wiring in the wiring structure, and wherein the first heat transferring terminal and the second heat transferring terminal are commonly connected to the single wiring.
Dependencies are inferred from the claim text.