Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place
AssigneeBoard of Regents, The University of Texas System
InventorsSidlgata V. Sreenivasan, Paras Ajay, Aseem Sayal, Mark McDermott, Shrawan Singhal, Ovadia Abed, Lawrence Dunn, Vipul Goyal, Michael Cullinan
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Abstract
A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.
Claims37
A method for assembling components onto a product substrate, the method comprising:
- selectively picking one or more elements from a source wafer by a vacuum superstrate attached to said one or more elements;
- placing said selectively picked one or more elements onto an adhesive on said product substrate with sub-100 nm placement precision, wherein said adhesive is in a liquid state at a time of said placing which enables said sub-100 nm placement precision, wherein said adhesive is inkjetted or spin-coated onto said product substrate;
- and
- securely attaching said selectively picked one or more elements onto said product substrate by holding onto said one or more elements using said vacuum superstrate until said adhesive reaches its gel point.
A method for assembling components onto a product substrate, the method comprising:
- selectively picking one or more elements from a source wafer by a vacuum superstrate attached to said one or more elements;
- placing said selectively picked one or more elements onto said product substrate, wherein said placing is performed with sub-100 nm placement precision;
- and
- securely attaching said selectively picked one or more elements onto said product substrate using direct bonding by holding onto said one or more elements using said vacuum superstrate until said attachment occurs.
A method for assembling components onto a product substrate, the method comprising:
- selectively picking one or more elements from a source wafer by a vacuum superstrate attached to said one or more elements;
- placing said selectively picked one or more elements onto an adhesive on said product substrate, wherein a top surface of said one or more elements being placed onto said adhesive on said product substrate is at a same height or higher than all previously placed elements on said product substrate, wherein said adhesive is in a liquid state at a time of said placing, wherein said adhesive is inkjetted or spin-coated onto said product substrate;
- and
- securely attaching said selectively picked one or more elements onto said product substrate by holding onto said one or more elements using said vacuum superstrate until said adhesive reaches its gel point.
A method for assembling components onto a product substrate, the method comprising:
- selectively picking one or more elements with a distribution from a source wafer by a vacuum superstrate attached to said one or more elements;
- placing said selectively picked one or more elements onto said product substrate, wherein said placing is performed with sub-100 nm placement precision, wherein said sub-100 nm placement precision is enabled by in-liquid fine alignment, and
- securely attaching said selectively picked one or more elements onto said product substrate by holding onto said one or more elements using said vacuum superstrate until attachment occurs.
Dependencies are inferred from the claim text.