Member for semiconductor manufacturing apparatus and method for manufacturing the same

A member for semiconductor manufacturing apparatus, comprising:

• a ceramic plate having a wafer placement surface and including a built-in electrode;
• a plug receiving hole formed in a surface of the ceramic plate opposite to the wafer placement surface;
• a gas outlet port that extends through a bottom wall of the plug receiving hole in the ceramic plate in a thickness direction of the ceramic plate;
• a plug received in the plug receiving hole;
• and
• a gas flow path disposed inside the plug to be continuous with the gas outlet port and allow gas flow in a thickness direction of the plug,
• wherein a stepped portion is disposed on a side surface of the plug or an inner surface of the plug receiving hole, the plug receiving hole and the plug are in contact with each other in an area deeper than the stepped portion, a gap is formed between the plug receiving hole and the plug in an area shallower than the stepped portion, and a plug support member made of an adhesive material is formed in the gap.