Back to results
US 12,009,231 B2Granted
Method of bonding substrates utilizing a substrate holder with holding fingers
AssigneeSamsung Electronics Co., Ltd.
InventorsJun-hyung Kim, Sung-hyup Kim, Tae-yeong Kim
Life of this patent
Estimating the term…
Abstract
A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.
Claims20
A substrate bonding method, comprising:
- arranging a substrate susceptor to hold a first substrate thereon;
- arranging a substrate holder to hold a second substrate thereon such that the first and second substrates are aligned with each other, the substrate holder including a plurality of holding fingers configured to hold an edge of the second substrate and move independently from each other;
- bringing a center of the second substrate to contact the first substrate;
- allowing a spontaneous bonding propagation between the first substrate and the second substrate to occur;
- bringing the second substrate closer to the first substrate while holding the edge of the second substrate;
- and
- releasing the holding of the edge of the second substrate.
4 more elements
A substrate bonding method, comprising:
- arranging a substrate susceptor to hold a first substrate thereon;
- arranging a substrate holder to hold a second substrate thereon such that the first substrate and the second substrate are aligned with each other, the substrate holder including a plurality of holding fingers configured to hold an edge of the second substrate and move independently from each other;
- measuring a distance between an edge of the first substrate and the edge of the second substrate using a distance sensor;
- bringing a center of the second substrate to contact the first substrate;
- moving the plurality of holding fingers toward the first substrate while holding the edge of the second substrate;
- and
- releasing the holding of the edge of the second substrate,
- wherein each of the plurality of holding fingers is controlled based on the distance sensed by the distance sensor.
5 more elements
A substrate bonding method, comprising:
- arranging a substrate susceptor to hold a first substrate thereon;
- arranging a substrate holder to hold a second substrate thereon such that the first and second substrates are aligned with each other, the substrate holder including a plurality of holding fingers configured to hold an edge of the second substrate and move independently from each other;
- measuring a distance between an edge of the first substrate and the edge of the second substrate using a distance sensor;
- bringing a center of the second substrate to contact the first substrate;
- allowing a spontaneous bonding propagation between the first substrate and the second substrate to occur while holding the edge of the second substrate;
- moving the plurality of holding fingers toward the first substrate while holding the edge of the second substrate;
- and
- releasing the holding of the edge of the second substrate,
- wherein each of the plurality of holding fingers is controlled based on the distance sensed by the distance sensor.
6 more elements
Dependencies are inferred from the claim text.