Low temperature chuck for plasma processing systems

A wafer chuck assembly, comprising:

• a shaft;
• a puck coupled with the shaft, the puck comprising:
• an electrically insulating material defining a top surface of the puck, wherein the electrically insulating material defines a recessed ledge extending to an outer radius of the electrically insulating material;
• a plurality of electrodes embedded within the electrically insulating material;
• an inner puck element that forms one or more channels for a heat exchange fluid;
• and
• an electrically conductive plate comprising a body disposed in contact with the inner puck element and defining a recessed cavity, wherein the inner puck element is seated within the recessed cavity, wherein the electrically conductive plate defines an outer radius of the puck, and wherein the electrically conductive plate defines an exterior housing of the shaft;
• and
• a ring element seated atop the top surface of the puck, the ring element comprising a body extending about the puck, wherein a first downward-facing portion of the ring element is disposed on and in contact with the recessed ledge of the electrically insulating material and a second downward-facing portion of the ring element is disposed on and in contact with an upward-facing portion of the electrically conductive plate defining the recessed cavity within the electrically conductive plate.