US 12,009,187 B2 · Plasma shutter and substrate processing apparatus including the same

Abstract

Provided is a substrate processing apparatus, including a process chamber, a plasma shutter configured ascend to close the process chamber, and an upper liner on the process chamber, wherein the process chamber includes a process space in which a substrate process is performed, and an insertion passage adjacent to the process space and connecting the process space to an outside of the process chamber, wherein the upper liner includes an extension liner, wherein the extension liner faces a connection inner surface that upwardly extends from an inner end of a passage ceiling forming the insertion passage, and wherein, in a state where the plasma shutter ascends to close the process space, an upper end of the plasma shutter is inserted between the connection inner surface and the extension liner.

Claims20

Dependent claims

A substrate processing apparatus, comprising:

a process chamber;
a plasma shutter configured ascend to close the process chamber;
and
an upper liner on the process chamber,
wherein the process chamber comprises:
a process space in which a substrate process is performed;
and
an insertion passage adjacent to the process space and connecting the process space to an outside of the process chamber,
wherein the upper liner comprises an extension liner,
wherein the extension liner faces a connection inner surface that upwardly extends from an inner end of a passage ceiling forming the insertion passage, and
wherein, in a state where the plasma shutter ascends to close the process space, an upper end of the plasma shutter is inserted between the connection inner surface and the extension liner.

8 more elements

Dependencies are inferred from the claim text.

Plasma shutter and substrate processing apparatus including the same

Life of this patent

Plasma shutter and substrate processing apparatus including the same

Life of this patent

Abstract

Claims20