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US 12,009,185 B2Granted
Semiconductor processing apparatus having improved temperature control
AssigneeApplied Materials, Inc.
InventorsJun Ma, Chen-An Chen
Life of this patent
Estimating the term…
Abstract
A pedestal for a semiconductor processing chamber is provided. The pedestal includes a first body comprising a ceramic material, wherein a plurality of heater elements are encapsulated within the first body, and a second body comprising a ceramic material, wherein one or more continuously curved grooves are formed in one or more surfaces of the second body. Additionally, the first body is coupled to the second body and encloses the grooves.
Claims18
A pedestal for a semiconductor processing chamber, comprising:
- a first body comprising a ceramic material that includes a first surface, wherein a plurality of heater elements are encapsulated within the first body;
- a second body comprising a ceramic material, the second body having one or more continuously curved grooves formed in one or more surfaces of the second body, the one or more continuously curved grooves having a bottom wall and a continuously curved sidewall;
- and
- a flexible temperature monitoring device disposed within the one or more continuously curved grooves, the flexible temperature monitoring device having a temperature sensing portion disposed at an end of the flexible temperature monitoring device, wherein:
- the first body is coupled to the second body,
- the first surface of the first body is positioned to enclose a region that is defined by the one or more continuously curved grooves formed in the one or more surfaces of the second body and a portion of the first surface, the portion of the first surface forming a top wall of the one or more continuously curved grooves, and
- the flexible temperature monitoring device and the temperature sensing portion are continuously positioned against the continuously curved sidewall of one or more of the one or more continuously curved grooves providing a gap between the flexible temperature monitoring device and along a sidewall opposite the continuously curved sidewall of the one or more of the one or more continuously curved grooves.
4 more elements
A pedestal for a semiconductor processing chamber, comprising:
- a first body comprising a ceramic material and a second body comprising a ceramic material;
- a plurality of heater elements encapsulated within the first body;
- one or more continuously curved grooves formed in one or more surfaces of the first body or the second body, wherein the first body is coupled to the second body and encloses the one or more continuously curved grooves, the one or more continuously curved grooves having a top wall, a bottom wall and continuously curved sidewalls;
- and
- a flexible temperature monitoring device having a temperature sensing portion, the flexible temperature monitoring device and the temperature sensing portion disposed within the one or more continuously curved grooves and continuously positioned against a continuously curved sidewall of one or more of the one or more continuously curved grooves along the length of the flexible temperature monitoring device and the temperature sensing portion providing a gap between the flexible temperature monitoring device and along a sidewall opposite the continuously curved sidewall of the one or more of the one or more continuously curved grooves.
2 more elements
A pedestal for a semiconductor processing chamber, comprising:
- a first body comprising a ceramic material that includes a first surface, wherein a plurality of heater elements are encapsulated within the first body;
- a second body comprising a ceramic material and a center hole positioned in the center of the second body, wherein one or more curved grooves having a bottom wall and a curved sidewall are formed in one or more surfaces of the second body;
- and
- a temperature monitoring device disposed within the one or more curved grooves, the temperature monitoring device having a temperature sensing portion, wherein:
- the first body is coupled to the second body,
- the first surface of the first body is positioned to enclose a region that is defined by the one or more curved grooves formed in the one or more surfaces of the second body and a portion of the first surface, the portion of the first surface forming a top wall of the one or more curved grooves, and
- the temperature monitoring device and the temperature sensing portion are continuously positioned against the curved sidewall of one or more of the one or more curved grooves along the length of the flexible temperature monitoring device and the temperature sensing portion providing a gap between the flexible temperature monitoring device and along a sidewall opposite the continuously curved sidewall of the one or more of the one or more continuously curved grooves.
4 more elements
Dependencies are inferred from the claim text.