Multilayer electronic component with conductive resin layer

A multilayer electronic component comprising:

• a body including a dielectric layer and an internal electrode;
• and
• an external electrode disposed on the body,
• wherein the external electrode includes:
• an electrode layer connected to the internal electrode,
• an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound, and
• a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin, and
• a sum of a number of particles having a Feret diameter of 10 μm or more, among particles of the conductive connection portion and the plurality of metal particles, is N1, a total number of the particles of the conductive connection portion and the plurality of metal particles is N2, and a ratio (N1/N2) of the N1 to the N2 is 15% or more.

A multilayer electronic component comprising:

• a body including a dielectric layer and an internal electrode;
• and
• an external electrode disposed on the body,
• wherein the external electrode includes:
• an electrode layer connected to the internal electrode,
• an intermetallic compound layer disposed on the electrode layer and including Cu3Sn and glass, and
• a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin, and
• a portion of the conductive connection portion is in direct contact with a portion of the Cu3Sn included in the intermetallic compound layer.