Stacked spiral inductor
AssigneeCsmc Technologies Fab2 Co., Ltd.
InventorCongying Dong
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Abstract
A stacked spiral inductor, comprising: a substrate, and multiple stacked insulating layers and inductive metal layers formed on the substrate by means of a semiconductor process. Each inductive metal layer comprises a conductive coil in a shape of a spiral and a through hole area used for connecting two adjacent inductive metal layers. The conductive coils of the inductive metal layers have a common coil center. In two adjacent inductive metal layers, the conductive coil of the lower inductive metal layer is retracted toward the coil center with respect to the conductive coil of the upper inductive metal layer.
Claims8
A stacked spiral inductor, comprising:
- a substrate, and multiple stacked insulating layers and inductive metal layers formed on the substrate via a semiconductor process;
- wherein an inductive metal layer comprises a conductive coil in a shape of a spiral, and a through hole area configured to connect two adjacent inductive metal layers, and the conductive coils of the inductive metal layers have a common coil center;
- and
- wherein in two adjacent inductive metal layers, a conductive coil of a lower inductive metal layer is retracted towards the coil center with respect to a conductive coil of an upper inductive metal layer;
- wherein the conductive coil of each inductive metal layer comprises a lead end and an opening end opposite to the lead end;
- an inductive metal layer located on a top is a first inductive metal layer, an inductive metal layer arranged adjacent to the first inductive metal layer is a second inductive metal layer, and an inductive metal layer adjacent to and below the second inductive metal layer is a third inductive metal layer;
- a through hole area in the first inductive metal layer configured to connect with the second inductive metal layer is arranged at the opening end of the first inductive metal layer, and the lead end of the first inductive metal layer is a lead terminal of the spiral inductor;
- and
- a through hole area in the second inductive metal layer configured to connect with the third inductive metal layer is arranged at the same side as the lead end of the first inductive metal layer;
- the stacked spiral inductor further comprises a patterned ground shield arranged between the substrate and a bottommost inductive metal layer;
- wherein the patterned ground shield is provided with a plurality of concentric metal rings, and each metal ring is provided with a plurality of metal strips perpendicular to the metal ring, and a length of the metal strip is less than a distance between two adjacent metal rings.
Dependencies are inferred from the claim text.