Fixing structure of wiring member, and wiring member with heat generation layer

A wiring member with a heat generation layer, comprising:

• a wiring member including at least one wire-like transmission member;
• and
• a heat generation layer provided to surround a periphery of the wiring member, wherein
• the heat generation layer is a layer which can generate heat by induction heating, and is an outermost layer in a periphery of the wiring member.

A fixing structure of a wiring member, comprising:

• a wiring member including at least one wire-like transmission member;
• a heat generation layer provided to surround a periphery of the wiring member;
• an adherend to which the wiring member is fixed;
• and
• a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein
• the heat generation layer is a layer which can generate heat by induction heating,
• the joint layer is a layer having bond properties when heat is transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member,
• the joint layer includes an adherend side joint layer provided between the heat generation layer and the adherend to be joined to the heat generation layer and the adherend, and
• a part of the heat generation layer along a circumferential direction of the wiring member is joined to the adherend side joint layer, and another part of the heat generation layer which is not joined to the adherend side joint layer along the circumferential direction of the wiring member is exposed.

A fixing structure of a wiring member, comprising:

• a wiring member including at least one wire-like transmission member;
• a heat generation layer provided to surround a periphery of the wiring member;
• an adherend to which the wiring member is fixed;
• and
• a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein
• the heat generation layer is a layer which can generate heat by induction heating,
• the joint layer is a layer having bond properties when heat is transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member,
• the joint layer includes an adherend side joint layer provided between the heat generation layer and the adherend to be joined to the heat generation layer and the adherend,
• a fixation surface of the adherend is a planar surface, and the adherend side joint layer is provided to extend along the fixation surface, and
• a part of the heat generation layer along a circumferential direction of the wiring member is joined to the adherend side joint layer, and another part of the heat generation layer which is not joined to the adherend side joint layer along the circumferential direction of the wiring member is exposed.