Touch light-emitting module having hollowed portion for incapsulation resin and manufacturing method thereof

A touch light-emitting module, comprising:

• a printed circuit board, the printed circuit board having a top surface on which a touch-control integrated circuit (IC) and at least one luminous unit in electrical connection with the touch-control IC are disposed;
• and
• a touch-control conductor combined with the printed circuit board through a conductive material, the touch-control conductor being formed with a hollowed portion in which the touch-control IC and the luminous unit are located, the hollowed portion receiving an encapsulation resin to inject therein to form encapsulation of the touch light-emitting module;
• wherein the touch-control conductor is formed of a plurality of copper-foil layers and at least one insulator layer that are alternately stacked on each other, and the touch-control conductor comprises an electrically conductive body, the electrically conductive body being arranged to connect, in a direction of the stacking, at least two of the copper-foil layers and the insulator layer between the copper-foil layers to establish electrical connection between the copper-foil layers.