Nozzle, substrate processing apparatus, and substrate processing method

A substrate processing apparatus comprising:

• a substrate holder configured to rotatably hold a substrate;
• a fluid supplier configured to supply a fluid containing steam or mist of pressurized pure water;
• a processing liquid supplier configured to supply a processing liquid containing at least sulfuric acid;
• a nozzle connected to the fluid supplier and the processing liquid supplier and configured to mix the fluid and the processing liquid and eject a mixed fluid of the fluid and the processing liquid to the substrate;
• and
• a controller configured to control the substrate holder, the fluid supplier, the processing liquid supplier, and the nozzle,
• wherein the nozzle includes:
• a first ejection port configured to eject the fluid;
• a second ejection port configured to eject the processing liquid;
• and
• a lead-out path extending vertically downward to form an inner wall surface, configured to be in fluid communication with the first ejection port and the second ejection port, and configured to lead out the mixed fluid of the fluid ejected from the first ejection port and the processing liquid ejected from the second ejection port,
• wherein the first ejection port or the second ejection port is arranged to be directed to a position deviated from a central axis of the lead-out path in a plan view,
• wherein the controller is configured to tilt the nozzle in a state in which the substrate held on the substrate holder is rotated such that the lead-out path is arranged obliquely with respect to a rotation direction of the substrate, and
• wherein the controller is configured to eject the mixed fluid from the nozzle toward the substrate.

A substrate processing method in a substrate processing apparatus,

• wherein the substrate processing apparatus comprises:
• a substrate holder configured to rotatably hold a substrate;
• a fluid supplier configured to supply a fluid containing steam or mist of pressurized pure water;
• a processing liquid supplier configured to supply a processing liquid containing at least sulfuric acid;
• and
• a nozzle connected to the fluid supplier and the processing liquid supplier and configured to mix the fluid and the processing liquid and eject a mixed fluid of the fluid and the processing liquid to the substrate,
• wherein the nozzle includes:
• a first ejection port configured to eject the fluid;
• a second ejection port configured to eject the processing liquid;
• and
• a lead-out path extending vertically downward to form an inner wall surface, configured to be in fluid communication with the first ejection port and the second ejection port, and configured to lead out the mixed fluid of the fluid ejected from the first ejection port and the processing liquid ejected from the second ejection port,
• wherein the first ejection port or the second ejection port is arranged to be directed to a position deviated from a central axis of the lead-out path in a plan view, and
• wherein the substrate processing method comprises:
• tilting the nozzle in a state in which the substrate held on the substrate holder is rotated such that the lead-out path is arranged obliquely with respect to a rotation direction of the substrate;
• and
• ejecting the mixed fluid from the nozzle toward the substrate.