Package structure having grating coupler and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Wei Kuo, Chewn-Pu Jou, Hsing-Kuo Hsia, Chih-Wei Tseng
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Abstract
A package structure comprises photonic dies and an interposer structure. Each photonic die includes a dielectric layer and a first grating coupler embedded in the dielectric layer. The interposer structure is disposed below the photonic dies. The interposer structure includes an oxide layer and a second grating coupler embedded in the oxide layer. The photonic dies are optically coupled through the first grating couplers of the photonic dies and the second grating coupler of the interposer structure.
Claims20
A package structure, comprising:
- photonic dies, each photonic die including a dielectric layer and a first grating coupler embedded in the dielectric layer;
- and
- an interposer structure, disposed below the photonic dies, wherein the interposer structure includes an oxide layer and a second grating coupler embedded in the oxide layer,
- wherein the photonic dies are optically coupled through the first grating couplers of the photonic dies and the second grating coupler of the interposer structure.
A package structure, comprising:
- a first photonic die including a first grating coupler configured to receive and transmit a light beam;
- a second photonic die, disposed beside and adjacent to the first photonic die and including a second grating coupler configured to transmit and emit the light beam;
- a first lens disposed over the first photonic die above the first grating coupler;
- a second lens disposed over the second photonic die above the second grating coupler;
- and
- an interposer structure, disposed below the first and second photonic dies and including a third grating coupler configured to waveguide the light beam,
- wherein the first and second photonic dies are optically coupled through the light beam waveguided between the first, third, and second grating couplers.
A method for manufacturing a package structure, comprising:
- providing an interposer structure, wherein the interposer structure is provided with a first oxide layer, a first grating coupler on the first oxide layer, and a second oxide layer over the first oxide layer and covering the first grating coupler;
- disposing a first photonic die including a second grating coupler on the second oxide layer;
- and
- disposing a second photonic die including a third grating coupler on the second oxide layer,
- wherein the first and second photonic dies are optically coupled through the first grating coupler of the interposer structure and the second and third grating couplers.
Dependencies are inferred from the claim text.