A test system for a semiconductor structure, comprising:
- a test platform being configured to run a test program to test a semiconductor structure to be tested;
- a socket being arranged on the test platform and being configured to provide a test site for the semiconductor structure to be tested;
- an indicator light being arranged on the test platform and being configured to indicate different results through different display manners;
- an image collection part being configured to read a state indicated by the indicator light and also to scan information of the semiconductor structure to be tested on the corresponding test platform,
- a mechanical arm assembly being located above the test platform and the mechanical arm assembly comprising a mechanical arm, a first operating mechanism and a second operating mechanism;
- and
- a server being in signal connection with the test platform and in signal connection with the mechanical arm;
- wherein mechanical arm comprises:
- a body and an operating arm, the operating arm comprising:
- a connector, the connector being connected to the body;
- a first adapting part, the first adapting part being connected to the connector, and the first adapting part being configured to mount a first operating mechanism for opening and closing the socket;
- and
- a second adapting part, the second adapting part being connected to the connector, and the second adapting part being configured to mount a second operating mechanism for grabbing and releasing the semiconductor structure to be tested,
- a rotating member, the rotating member being connected to the connector, and both of the first adapting part and the second adapting part are arranged on the rotating member, so that both of the first adapting part and the second adapting part are connected to the connector through the rotating member;
- wherein after the first adapting part drives the first operating mechanism to open the socket, the second adapting part is able to drive the second operating mechanism to put the semiconductor structure into the socket or take the semiconductor structure out from the socket.