Prober controlling device, prober controlling method, and prober
AssigneeTokyo Seimitsu Co., Ltd.
InventorsTetsuo Yoshida, Shunsuke Otake, Tatsuya Matsuoka
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AssigneeTokyo Seimitsu Co., Ltd.
InventorsTetsuo Yoshida, Shunsuke Otake, Tatsuya Matsuoka
Estimating the term…
A prober controlling device for bringing probe needles into contact with semiconductor chips, includes an input data acquiring unit configured to acquire input data including temperature data of at least one of a probe card and a card holder, a predicting unit configured to predict a position of a tip end of a probe needle based on the input data acquired by the input data acquiring unit, using a prediction model that receives input of the input data and outputs the position of the tip end of the probe needle, and a determining unit configured to determine whether or not to execute prediction by the predicting unit, based on input data used as teacher data for machine learning of the prediction model and the input data acquired by the input data acquiring unit, before the prediction by the predicting unit.
A prober controlling device for a prober including a wafer chuck configured to hold a wafer on which semiconductor chips are formed, a probe card having probe needles, a card holder configured to hold an outer periphery of the probe card and place the probe card opposite the wafer and a relative moving unit configured to move the wafer chuck relatively to the probe needles, the prober controlling device being configured to drive the relative moving unit to bring the probe needles into contact with the semiconductor chips, the prober controlling device comprising:
A prober controlling method for a prober including a wafer chuck configured to hold a wafer on which semiconductor chips are formed, a probe card having probe needles, a card holder configured to hold an outer periphery of the probe card and place the probe card opposite the wafer and a relative moving unit configured to move the wafer chuck relatively to the probe needles, the prober controlling method of driving the relative moving unit to bring the probe needles into contact with the semiconductor chips, the prober controlling method comprising:
Dependencies are inferred from the claim text.