System and method for building detection model based on standard value to confirm soldering status

A system for building a detection model based on a standard value to confirm a soldering status, comprising at least:

• a data collection module to collect a plurality of standard value data and a plurality of first solder joint data, and to collect at least one second solder joint data, wherein each of the plurality of first solder joint data corresponds to one of solder joints of an existing PCB layout, and each of the plurality of standard value data corresponds to at least one of the solder joints, wherein each of the at least one second solder joint data corresponds to one solder joint of a to-be-tested PCB with the existing PCB layout;
• a solder joint classification module to generate one or more solder joint classifications according to the plurality of standard value data, wherein each of the solder joint classifications includes at least one of the solder joints;
• a model building module to build a detection model based on solder joint data corresponding to each of the solder joints included in each of the solder joint classifications;
• and
• a data analysis module to sequentially analyze whether each of the at least one second solder joint data includes poor soldering by using the detection model;
• wherein the plurality of standard value data comprises:
• upper and lower limits of a volume, area, height, horizontal offset, and vertical offset of each of the solder joints;
• or
• a width, height, and area of a plurality of pads including at least one of the solder joints.