Thermal management in integrated circuit packages

An integrated circuit (IC) package, comprising:

• a package substrate;
• a first component coupled to the package substrate;
• a second component coupled to the package substrate;
• and
• a vapor chamber, wherein the first component is between the vapor chamber and the package substrate, the second component is between the vapor chamber and the package substrate, and the vapor chamber includes:
• an evaporator having a wick region at a first portion of an interior surface of the evaporator,
• a condenser having an interior surface facing the interior surface of the evaporator, and
• side walls between the interior surface of the condenser and the interior surface of the evaporator, the side walls sealing a vapor space between the interior surface of the condenser and the interior surface of the evaporator,
• wherein:
• the interior surface of the evaporator further includes a second portion,
• the second portion is outside of the wick region, and
• within the vapor space, the second portion is angled toward the wick region, is in contact with the first portion, and is separated from the condenser by the vapor space.

A vapor chamber, comprising:

• an evaporator having a wick region at an interior surface, wherein a portion of the interior surface of the evaporator, outside the wick region, is angled toward the wick region and is in contact with the wick region;
• a condenser, wherein an interior surface of the condenser is opposite the interior surface of the evaporator;
• and
• side walls between the interior surface of the condenser and the interior surface of the evaporator,
• wherein the interior surface of the condenser and the interior surface of the evaporator are separated from one another by a space, and wherein the space is a vapor conduit sealed by the side walls.