Film layer curing apparatus

A film layer curing apparatus, comprising:

• a support platform, configured to carry a substrate having a film layer on a substrate surface;
• and
• a light source component, located above the support platform, the light source component comprising a light source array being arranged toward the support platform and covering a light outgoing surface of the entire film layer by projection of the light source array, the light source array comprising multiple point light sources evenly distributed on the light outgoing surface, light emitted by the light source array being able to uniformly irradiate the entire film layer so as to improve a thickness distribution uniformity of the film layer after curing, the light source component further comprising multiple reflectors located on a side of the light source array away from the support platform to reflect light emitted by the light source array, and the multiple reflectors being in one-to-one correspondence with the multiple point light sources, the light source component further comprising multiple sensors that are in one-to-one correspondence with the multiple point light sources, and each of the multiple sensors being configured to detect an intensity of light emitted by a corresponding one of the multiple point light sources.