Polishing liquid and chemical mechanical polishing method

A polishing liquid used for chemical mechanical polishing of an object to be polished having a cobalt-containing film, the polishing liquid comprising:

• colloidal silica;
• one or more specific compounds selected from the group consisting of glycine, alanine, sarcosine, and iminodiacetic acid;
• one or more passivation film forming agents selected from the group consisting of a compound represented by General Formula (1) and a compound represented by General Formula (2);
• hydrogen peroxide;
• sodium, wherein a content of sodium is 5 ppt to 250 ppt by mass with respect to a total mass of the polishing liquid;
• and
• ammonia,
• wherein a ClogP value of the passivation film forming agent is 1.0 or more, a mass ratio of a content of ammonia to the content of sodium is 1×103 to 1×106, and a pH is 5.5 to 8.0,
• in General Formula (1), R1 to R5 each independently represent a hydrogen atom or a substituent, and
• two adjacent groups in R1 to R5 may be bonded to each other to form a ring, and
• in General Formula (2), R6 to R10 each independently represent a hydrogen atom or a substituent, and
• two adjacent groups in R6 to R10 may be bonded to each other to form a ring.