Additive manufacturing of polishing pads
AssigneeApplied Materials, Inc.
InventorsAtul Bhaskar Chaudhari, Sivapackia Ganapathiappan, Srobona Sen
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Abstract
A system, formulation, and method for additive manufacturing of a polishing layer of a polishing pad. The formulation includes a urethane acrylate oligomer based on a difunctional polyol or difunctional polythiol. The techniques includes selecting the difunctional polyol or the difunctional polythiol to affect a property of the polishing layer. The formulation also includes a monomer and a photoinitiator. The viscosity of the formulation is applicable for 3D printing of the polishing layer.
Claims18
A method of manufacturing a polishing pad, comprising:
- correlating multiple difunctional polyols with a property of a polishing layer of the polishing pad, wherein the property comprises ultimate tensile strength (UTS), storage modulus, glass transition temperature, or melting point, or any combinations thereof, wherein the multiple difunctional polyols comprise linear aliphatic polyester polyols;
- selecting a difunctional polyol that is a linear aliphatic polyester polyol of the multiple difunctional polyols to affect the property of the polishing layer of the polishing pad to give a specified value of the property;
- performing a catalytic reaction of the difunctional polyol as selected with a difunctional isocyanate to give a urethane oligomer;
- capping the urethane oligomer with an acrylate to give a urethane acrylate oligomer, wherein the urethane acrylate oligomer as applied in additive manufacturing of the polishing pad affects the property to give the specified value;
- and
- performing the additive manufacturing including injecting a formulation through a three dimensional (3D) printer nozzle to form the polishing layer of the polishing pad, the formulation comprising 15 weight percent (wt %) to 25 wt % of the urethane acrylate oligomer and 70 wt % to 80 wt % of an acrylic monomer, wherein the polishing layer comprises a storage modulus at 90° C. in a range of 100 megapascal (MPa) to 300 MPa, and wherein the polishing pad comprises a chemical-mechanical planarization (CMP) pad.
A method of additive manufacturing of a polishing pad, comprising:
- choosing a difunctional polyol comprising a linear aliphatic polyester polyol to affect a viscosity of a three dimensional (3D) printing formulation having urethane acrylate oligomer and to affect a property of a polishing layer of the polishing pad, wherein the property comprises ultimate tensile strength (UTS), storage modulus, glass transition temperature, or melting point, or any combinations thereof;
- reacting in presence of catalyst the difunctional polyol with a difunctional isocyanate to give a urethane oligomer prepolymer;
- incorporating an acrylate as end caps on the urethane oligomer prepolymer to give the urethane acrylate oligomer, wherein the urethane acrylate oligomer affects the property;
- preparing the 3D printing formulation comprising 15 wt % to 25 wt % of the urethane acrylate oligomer and 70 wt % to 80 wt % of acrylic monomer;
- and
- injecting the 3D printing formulation through a 3D printer nozzle, thereby forming the polishing layer of the polishing pad, wherein the polishing layer comprises a storage modulus at 90° C. in a range of 100 megapascal (MPa) to 300 MPa, wherein the polishing pad comprises a chemical-mechanical planarization (CMP) pad.
Dependencies are inferred from the claim text.