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US 12,006,308 B2Granted
Adhesive composition for semiconductor circuit connection and adhesive film containing the same
AssigneeLG Chem, Ltd.
InventorsYoungsam Kim, Junghak Kim, Ju Hyeon Kim, Kwang Joo Lee
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Abstract
The present disclosure relates to a polymer compound having a specific structure, including an acrylic resin having a functional group capable of mutual hydrogen bonding with an acrylic resin having imidazole, a resin composition for bonding semiconductors including a thermoplastic resin; a thermosetting resin; a curing agent; and the polymer compound having a specific structure, and an adhesive film for semiconductor produced using the same.
Claims9
A compound represented by Chemical Formula 1:
- wherein, in the Chemical Formula 1,
- R and R′ are each independently hydrogen, an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms or a cyclic hydrocarbon having 3 to 8 carbon atoms, wherein the alkyl group, the aryl group or the cyclic hydrocarbon optionally contains a heteroatom,
- each x is independently 1 to 50,
- each y is independently 1 to 100 and
- each z is independently 1 to 4.
2 more elements
Dependencies are inferred from the claim text.