Direct graphene transfer and graphene-based devices
AssigneeCorning Incorporated
InventorsTherese Francoise Arliguie, Theresa Chang, Miriam Marchena Martin-Francés, Prantik Mazumder, Valerio Pruneri, Frederic Christian Wagner
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Abstract
A method of forming a functionalized device substrate is provided that includes the steps of: forming a conductive layer on a growth substrate; applying a polymeric layer to a device substrate, wherein a coupling agent couples the polymeric layer to the device substrate; coupling the polymeric layer to the conductive layer on the growth substrate; and peeling the growth substrate from the conductive layer.
Claims17
A functionalized device substrate, comprising:
- a substrate defining a surface;
- a polyimide layer disposed over the surface of the substrate, wherein an aminosilane couples the polyimide layer to the surface;
- and
- a graphene layer coupled to the polyimide layer, wherein the graphene layer has a sheet resistance of from about 100 Ohm/sq to about 600 Ohm/sq.
A functionalized device substrate, comprising:
- a substrate defining a surface;
- a polyimide layer disposed over the surface of the substrate, wherein an aminosilane couples the polyimide layer to the surface;
- and
- a graphene layer coupled to the polyimide layer, wherein the graphene layer has a sheet resistance of from about 100 Ohm/sq to about 600 Ohm/sq, and wherein the graphene layer is as-pressed against the polyimide layer at a pressure of from about 150 psi to about 350 psi.
A functionalized device substrate, comprising:
- a substrate defining a surface;
- a polymer layer disposed over the surface of the substrate, wherein an aminosilane couples the polymer layer to the surface;
- and
- a graphene layer coupled to the polymer layer, wherein the graphene layer has a sheet resistance of from about 100 Ohm/sq to about 600 Ohm/sq, and further wherein the polymer layer is composed of a polyimide or a polythiophene.
Dependencies are inferred from the claim text.