Packaged image sensor and endoscope

A packaged image sensor, comprising:

• a substrate, including a first surface, a second surface opposite to the first surface, a through-hole, a plurality of first electric-conduction contacts, a plurality of second electric-conduction contacts, and a plurality of third electric-conduction contacts, wherein the plurality of second electric-conduction contacts and the plurality of third electric-conduction contacts are disposed on the first surface, the plurality of first electric-conduction contacts are disposed on the second surface, and the plurality of second electric-conduction contacts and the plurality of third electric-conduction contacts are electrically connected with the plurality of corresponding first electric-conduction contacts;
• an image sensor, disposed on the substrate and electrically connected with the plurality of second electric-conduction contacts;
• a light-emitting element, disposed on the substrate and near the image sensor and electrically connected with the plurality of third electric-conduction contacts;
• and
• a first encapsulant, filled into a space between the image sensor and the light-emitting element with the through-hole of the substrate kept opened;
• wherein a pipe is disposed inside the through-hole of the substrate and protruding from the second surface of the substrate where the first electric-conduction contacts are disposed.