Display panel including anti-crack structure within chamfered recess, manufacturing method thereof and display device
AssigneesWuhan China Star Optoelectronics Technology Co., Ltd., Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorJunyuan Wang
Life of this patent
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Abstract
A display panel, a manufacturing method thereof, and a display device are disclosed. For the display panel, an anti-crack structure is disposed in a chamfer between a driving circuit layer and a substrate. The anti-crack structure is in contact with a packaging layer to reduce an angle from the contact plane of the anti-crack structure and the packaging layer to the plane in which a light-emitting layer is located, so that the packaging layer is smoothly disposed, the risk of the fracture of the packaging layer is lowered, and the failure of the display panel is avoided.
Claims18
A display panel comprising a display area and an electronic component disposition area, wherein the display panel comprises:
- a substrate comprising a recess located in the display area and the electronic component disposition area, wherein the recess comprises a chamfer located in the display area;
- a driving circuit layer disposed on one side of the substrate, wherein the driving circuit layer is disposed in the display area;
- a light-emitting layer disposed on one side of the driving circuit layer away from the substrate;
- a packaging layer disposed on one side of the light-emitting layer away from the driving circuit layer;
- wherein the chamfer is defined between the driving circuit layer and the substrate, the chamfer is provided with an anti-crack structure, the anti-crack structure is in contact with the packaging layer, and the anti-crack structure is configured for reducing an angle from a contact plane of the anti-crack structure and the packaging layer to a plane in which the light-emitting layer is located, wherein the contact angle is less than 90 degrees, and wherein the packaging layer contacts the side surfaces of the driving circuit layer and the light emitting layer.
A display panel manufacturing method, comprising:
- providing a substrate;
- forming a driving circuit layer on the substrate, and etching the substrate to form a recess, wherein the recess is disposed in a display area and an electronic component disposition area, the recess comprises a chamfer located in the display area, and the driving circuit layer is disposed in the display area;
- forming a light-emitting layer on the driving circuit layer, wherein the light-emitting layer comprises a first light-emitting layer located on the driving circuit layer and a second light-emitting layer located in the electronic component disposition area;
- forming an anti-crack structure in the chamfer;
- forming a packaging layer on the light-emitting layer, wherein the anti-crack structure is configured for reducing an angle from a contact plane of the anti-crack structure and the packaging layer to a plane in which the light-emitting layer is located, wherein the contact angle is less than 90 degrees, and wherein the packaging layer contacts the side surfaces of the driving circuit layer and the light emitting layer.
A display device, comprising:
- a display panel comprising a display area and an electronic component disposition area, wherein the display panel comprises a substrate, a driving circuit layer, a light-emitting layer, and a packaging layer, wherein the substrate comprises a recess located in the display area and the electronic component disposition area, and the recess comprises a chamfer located in the display area;
- the driving circuit layer is disposed on one side of the substrate, and the driving circuit layer is disposed in the display area;
- the light-emitting layer is disposed on one side of the driving circuit layer away from the substrate, and the packaging layer is disposed on one side of the light-emitting layer away from the driving circuit layer;
- wherein the chamfer is defined between the driving circuit layer and the substrate, the chamfer is provided with an anti-crack structure, the anti-crack structure is in contact with the packaging layer, and the anti-crack structure is configured for reducing an angle from a contact plane of the anti-crack structure and the packaging layer to a plane in which the light-emitting layer is located;
- an electronic component disposed in the electronic component disposition area.
Dependencies are inferred from the claim text.