Cooling automotive power electronics

A system for cooling a power electronics module using a fluid, the system comprising:

• a housing comprising a thickness and configured to contain the power electronics module;
• a molding comprising at least one slot and configured to extend through the thickness, creating a first seal with the thickness, and contact at least a portion of the power electronics module;
• an electrical connection extending through the slot and comprising a planar surface which extends through the molding and a cylindrical extension which extends through the thickness, creating a second seal with the thickness;
• and
• a manifold positioned within the housing;
• wherein:
• the power electronics module comprises a first side and a second side,
• the electrical connection is configured to contact at least a portion of the power electronics module,
• the manifold is configured to direct the fluid to contact the first side and the second side,
• the first seal comprises interlocking grooves of the molding and the thickness,
• the second seal comprises interlocking grooves of the cylindrical extension and the thickness, and
• the fluid is configured to contact the power electronics module and the electrical connection inside the housing.