Metallic thermal interface materials and associated devices, systems, and methods

An integrated heat-spreader configured to overlie an integrated-circuit die, the integrated heat-spreader comprising:

• a first major surface defining a thermal-interface surface and being configured to face a heat-removal device;
• a second major surface positioned opposite the thermal-interface surface and being configured to face the integrated-circuit die;
• and
• a metallic thermal-interface material bonded to the thermal-interface surface, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C., wherein the metallic thermal-interface material is a non-eutectic mixture of Bismuth, Indium, Tin and Gallium.

A heat-removal device configured to dissipate heat received from a heat-generating electronic component, the heat-removal device comprising:

• a base defining a first major surface and a second major surface opposite the first major surface;
• a metallic thermal-interface material bonded to the first major surface, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C., wherein the metallic thermal-interface material is a eutectic mixture of Bismuth, Indium, Tin and Gallium;
• and
• a plurality of fins extending from the second major surface.

An electrical device, comprising:

• a heat-generating component defining a first thermal-interface surface;
• an integrated heat spreader configured to overlie the heat-generating component, the integrated heat spreader defining a first major surface and a second major surface positioned opposite the first major surface, the first major surface being configured to face a heat-removal device and the second major surface being configured to face the heat-generating component;
• and
• a metallic thermal-interface material bonded to the second major surface of the integrated heat spreader, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C.;
• wherein the metallic thermal-interface material is a eutectic mixture of Bismuth, Indium, Tin and Gallium.

A heat-removal device configured to dissipate heat received from a heat-generating electronic component, the heat-removal device comprising:

• a base defining a first major surface and a second major surface opposite the first major surface;
• a metallic thermal-interface material bonded to the first major surface, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C., wherein the metallic thermal-interface material is a non-eutectic mixture of Bismuth, Indium, Tin and Gallium;
• and
• a plurality of fins extending from the second major surface.

An electrical device, comprising:

• a heat-generating component defining a first thermal-interface surface;
• an integrated heat spreader configured to overlie the heat-generating component, the integrated heat spreader defining a first major surface and a second major surface positioned opposite the first major surface, the first major surface being configured to face a heat-removal device and the second major surface being configured to face the heat-generating component;
• and
• a metallic thermal-interface material bonded to the second major surface of the integrated heat spreader, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C.;
• wherein the metallic thermal-interface material is a non-eutectic mixture of Bismuth, Indium, Tin and Gallium.