Devices of drawing out surface heat of electronic components

A device of drawing out surface heat of an electronic component, comprising:

• a housing, comprising opposite a contact wall and a heat dissipating wall, and a side wall respectively connected to the contact wall and the heat dissipating wall, wherein the contact wall can be disposed on a hot surface of an electronic component, and the heat dissipating wall has fins formed thereon;
• a liquid inlet port and a liquid outlet port, formed on the side wall;
• a partition wall, formed in the housing, and connected to inner surfaces of the contact wall, the heat dissipating wall and the side wall, to divide interior of the housing into an inflow channel and an outflow channel, wherein the inflow channel communicates with the liquid inlet port, the outflow channel communicates with the liquid outlet port, and a side of the partition wall away from the liquid inlet port has passages communicating with the inflow channel and the outflow channel;
• and
• flow guiding walls, respectively formed in the inflow channel and the outflow channel, and connected to the inner surface of the contact wall.