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US 12,004,320 B2Granted
Thermal component and electronic device
AssigneeHuawei Technologies Co., Ltd.
InventorsYang Luo, Qi Chen, Haitao Zhen, Zhiguo Zhang, Chao Li
Life of this patent
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Abstract
A thermal system includes a system component, a working medium, a second-level thermal component, and a working medium transmission component. The system component includes a first-level thermal component and a working medium driver. The working medium driver is configured to drive the working medium to flow through a primary flow-through structure, a secondary flow-through structure, and a transmission channel in the working medium transmission component, and the thickness of the working medium driver is less than or equal to 5 mm.
Claims20
A thermal system, comprising:
- a first component, comprising a primary thermal plate and a driver, wherein the primary thermal plate comprises a first transmission channel;
- a working medium;
- a second component, comprising a secondary thermal plate, wherein the secondary thermal plate comprises a second transmission channel that comprises a secondary channel, wherein the secondary channel comprises a portion having a spiral shape in a plane, the secondary channel does not intersect itself at any location, a straight line that extends in the plane from a center point of the spiral shape to an outer edge of the spiral shape passes through at least two rings of the portion having the spiral shape, and the center point is completely encircled in the plane by the portion having the spiral shape;
- and
- a connector comprising a third transmission channel;
- wherein the primary thermal plate is in contact with a heat emitting element;
- wherein the connector is rotatably connected to the secondary thermal plate and the first component in a manner that the third transmission channel is configured to transmit the working medium with the first transmission channel and the second transmission channel;
- and
- wherein the driver is configured to drive the working medium to flow through the first transmission channel, the second transmission channel, and the third transmission channel, and a thickness of the driver is less than or equal to 5 mm.
6 more elements
An electronic device, comprising:
- a first housing and a second housing that are rotatably connected;
- a display mounted on the first housing;
- and
- a main board mounted on the second housing, wherein a heat emitting element is disposed on the main board;
- and
- a thermal system, comprising:
- a first component, comprising a primary thermal plate and a driver, wherein the primary thermal plate comprises a first transmission channel;
- a working medium;
- a second component, comprising a secondary thermal plate, wherein the secondary thermal plate comprises a second transmission channel that comprises a secondary channel, wherein the secondary channel comprises a portion having a spiral shape in a plane, the secondary channel does not intersect itself at any location, a straight line that extends in the plane from a center point of the spiral shape to an outer edge of the spiral shape passes through at least two rings of the portion having the spiral shape, and the center point is completely encircled in the plane by the portion having the spiral shape;
- and
- a connector comprising a third transmission channel;
- wherein the primary thermal plate is in contact with a heat emitting element;
- wherein the connector is rotatably connected to the secondary thermal plate and the first component in a manner that the third transmission channel is configured to transmit the working medium with the first transmission channel and the second transmission channel;
- and
- wherein the driver is configured to drive the working medium to flow through the first transmission channel, the second transmission channel, and the third transmission channel, and a thickness of the driver is less than or equal to 5 mm;
- wherein the first component is disposed on the second housing, and the primary thermal plate is in contact with the heat emitting element;
- and
- wherein the second component is disposed on the first housing, and the secondary thermal plate is connected to a back surface of the display and the first housing.
15 more elements
Dependencies are inferred from the claim text.