Process for laminating graphene-coated printed circuit boards

A lamination stack comprising:

• a core;
• a first adhesive layer applied to a top surface of the core;
• a first graphene-metal structure attached to the top surface of the core via the first adhesive layer, wherein the first graphene-metal structure comprises a first metal layer and a first graphene layer on at least one of a top surface of the first metal layer or a bottom surface of the first metal layer;
• and
• a second graphene-metal structure attached to a top surface of the first graphene-metal structure, wherein the second graphene-metal structure comprises a second metal layer and a second graphene layer on at least one of a top surface of the second metal layer or a bottom surface of the second metal layer,
• wherein the lamination stack comprises one or more holes, wherein each hole is defined by the first metal layer of the first graphene-metal structure, the second metal layer of the second graphene-metal structure, and intervening layers.

A lamination stack comprising:

• a core;
• a first adhesive layer applied to a top surface of the core;
• a first graphene-metal structure attached to the top surface of the core via the first adhesive layer, wherein the first graphene-metal structure comprises a first metal layer, a first graphene layer on a top surface of the first metal layer, and a first graphene layer on a bottom surface of the first metal layer;
• a second graphene-metal structure attached to a top surface of the first graphene-metal structure, wherein the second graphene-metal structure comprises a second metal layer, a second graphene layer on a top surface of the second metal layer, and a second graphene layer on a bottom surface of the second metal layer;
• and
• a second adhesive layer applied to a bottom surface of the core.