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US 12,004,301 B2Granted
Circuit board
AssigneeDongwoo Fine-Chem Co., Ltd.
InventorsKi Joon Park, Sung Jin Noh, Jungu Lee
Life of this patent
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Abstract
A circuit board includes a base layer, an electrode layer formed on the base layer, a passivation layer formed on the electrode layer while opening a part of the electrode layer, and a surface treatment layer formed on the open surface of the electrode layer. The surface treatment layer may contain 70 to 40% of copper and 30 to 60% of nickel.
Claims8
A circuit board, comprising:
- a base layer;
- an electrode layer formed on the base layer;
- a passivation layer formed on the electrode layer while opening a part of surface of the electrode layer;
- and
- a surface treatment layer formed on the open surface of the electrode layer,
- wherein
- the electrode layer includes a first electrode layer and a second electrode layer;
- the circuit board further comprises an insulation layer formed between the first electrode layer and the second electrode layer and a via penetrating the insulation layer to connect the first electrode layer and the second electrode layer;
- the passivation layer is formed on the second electrode layer, the insulation layer, and the via while opening a part of the second electrode layer;
- and
- the surface treatment layer is formed on the open surface of the second electrode layer.
8 more elements
Dependencies are inferred from the claim text.