Sensor device and methods of making and using the same
AssigneeShinkawa Electric Co., Ltd.
InventorsKotaro Matsumoto, Hiroyuki Matsuda, Hiroshi Aoki, Masaru Terada, Ovel Emerson, Paul A. Lowe
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AssigneeShinkawa Electric Co., Ltd.
InventorsKotaro Matsumoto, Hiroyuki Matsuda, Hiroshi Aoki, Masaru Terada, Ovel Emerson, Paul A. Lowe
Estimating the term…
Disclosed herein are devices, methods, and methods of making devices for facilitating condition monitoring of machinery allowing improve efficiencies and increased lifetime of the machinery while also reducing maintenance. In one embodiment, a device includes an enclosure assembly and a printed circuit board (PCB) assembly. The enclosure assembly includes a cap, a base mechanically coupled with the cap, and a support bracket mechanically coupled with the base. The PCB assembly includes a processor, a memory coupled with the processor, a first sensor electrically coupled with the processor, a second sensor electrically coupled with the processor, and a communication interface electrically coupled with the processor. The device, when installed, may generally form a shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.
A machinery condition monitoring device comprising:
A method of manufacturing a machinery condition monitoring device, the method comprising:
A method comprising:
Dependencies are inferred from the claim text.