Camera module and electronic device having the same

An electronic device comprising:

• a camera module comprising:
• a first circuit board, wherein a through groove is defined by an inner surface of the first circuit board, the inner surface comprises a first inner wall, a second inner wall, a third inner wall, and a fourth inner wall which are connected end to end;
• a lens on the first circuit board;
• a second circuit board in the through groove and a gap spacing the second circuit board and the inner surface, wherein the second circuit board comprises a first side surface, a second side surface, a third side surface, and a fourth side surface, the second side surface and the third side surface are spaced from each other and both connected between the first side surface and the fourth side surface, the first side surface faces the first inner wall, the second side surface faces the second inner wall, the third side surface faces the third inner wall, the fourth side surface faces the fourth inner wall;
• a photosensitive chip on the second circuit board, and a plane formed by a first direction and a second direction perpendicular to the first direction, wherein the plane is parallel to a plane where the photosensitive chip is located;
• an electrical connecting assembly located in the gap and electrically connected to the first circuit board and the second circuit board, wherein the electrical connecting assembly comprises two center-symmetrical first connecting members and two center-symmetrical second connecting members;
• one of the center-symmetrical first connecting members is connected the first inner wall and the second side surface, another of the center-symmetrical first connecting members is connected to the third inner wall and the fourth side surface;
• one of the two center-symmetrical second connecting members is connected to the second inner wall and the third side surface, another of the two center-symmetrical second connecting members is connected to the fourth inner wall and the first side surface;
• and
• a memory metal wire assembly on the first circuit board and electrically connected to the first circuit board, wherein the memory metal wire assembly is further electrically connected to the second circuit board to drive the photosensitive chip to move in the plane the photosensitive chip is located through the electrical connecting assembly.