Articles including metallized vias

A method of forming a metallized article, comprising the steps:

• forming a via through a body of a wafer such that the via has a via surface, the wafer comprising a glass, glass-ceramic, ceramic, or silicon material;
• applying an adhesion layer to the via surface as a plurality of discrete adhesion layer segments such that a portion of the via surface is free of the adhesion layer,
• the plurality of discrete adhesion layer segments comprising a first adhesion layer, a second adhesion layer, and a third adhesion layer that are applied in a discontinuous manner such that the via surface is free of the adhesion layer segments between the first adhesion layer and the second adhesion layer and between the second adhesion layer and the third adhesion layer,
• the portion of the via surface that is free of the adhesion layer comprising the glass, glass-ceramic, ceramic, or silicon material, and
• at least 10% of the via surface being free of the adhesion layer;
• and
• depositing a metal within the via such that the metal is in direct contact with the adhesion layer and with the portion of the via surface that is free of the adhesion layer.