Circuit board
AssigneesQing Ding Precision Electronics (Huaian) Co., Ltd, Avary Holding (Shenzhen) Co., Limited.
InventorZhi Guo
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a base plate includes the following steps: providing a first substrate, the first substrate including a first base layer, a first copper coating and a second copper coating covered on two sides of the first base layer; opening at least one first hole on the first substrate, the first hole penetrating the first base layer and the first copper; forming a first electroplated coating on the first copper coating, the first copper coating filling the first hole to form a first connecting portion; opening at least one second hole on the first connecting portion and the first electroplated coating to form a plurality of second connecting pins.
Claims9
A circuit board comprising:
- a first outer line layer, a second base layer, an inner line layer, a first base layer, and a second outer line layer arranged from top to bottom, the inner line layer comprising a first copper layer and a first electroplated layer, the first copper layer being sandwiched between the first electroplated layer and the first base layer;
- a first hole extending through the inner line layer and the first base layer;
- a first connecting portion formed in the first hole and being in contact with a sidewall of the first hole, the first connecting portion defining two second holes to divide the first connecting portion into three second connecting pins, the three second connecting pins being arranged in the first hole along a single direction, and connected to the second outer line layer and the inner line layer, the first electroplated layer being integrally formed with the three second connecting pins, adjacent two of the three second connecting pins being spaced from each other by one of the two second holes;
- and
- at least one fourth connecting pin connected between the first outer line layer and the inner line layer.
Dependencies are inferred from the claim text.