Printed circuit board

A printed circuit board comprising:

• a first multilayer substrate including first and second vias adjacent to each other in a stacking direction of the printed circuit board;
• a second multilayer substrate disposed on the first multilayer substrate in the stacking direction and including third and fourth vias adjacent to each other in the stacking direction;
• an insulating layer arranged between the first and second multilayer substrates;
• and
• an adhesive layer connecting respective one surfaces of the first and second multilayer substrates to each other,
• wherein each of the first to fourth vias has a first surface and a second surface facing the first surface, the first surface being closer to the adhesive layer than the second surface, and the first surface having a larger transverse cross-sectional area than the second surface,
• wherein the adhesive layer is disposed between a circuit pattern of the first multilayer substrate and a circuit pattern of the second multilayer substrate to connect the circuit pattern of the first multilayer substrate and the circuit pattern of the second multilayer substrate to each other,
• wherein the adhesive layer has a side surface which is substantially coplanar with a side surface of at least one of the circuit pattern of the first multilayer substrate or the circuit pattern of the second multilayer substrate,
• wherein the circuit pattern of the first multilayer substrate and the circuit pattern of the second multilayer substrate are embedded in the insulating layer, and
• wherein the second multilayer substrate includes a core substrate having upper and lower surfaces such that more build-up layers are disposed between the insulating layer and the upper surface in the stacking direction than that disposed on the lower surface.