Binning in hybrid pixel structure of image pixels and event vision sensor (EVS) pixels
AssigneeSony Semiconductor Solutions Corporation
InventorsPooria Mostafalu, Frederick T. Brady, Sungin Han, Hongyi Mi
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AssigneeSony Semiconductor Solutions Corporation
InventorsPooria Mostafalu, Frederick T. Brady, Sungin Han, Hongyi Mi
Estimating the term…
Binning in a hybrid pixel structure of image pixels and event vision sensor (EVS) pixels. In one embodiment, the imaging sensor includes a pixel array including a plurality of pixel circuits and a plurality of binning transistors. A first portion of the plurality of pixel circuits individually includes an intensity photodiode. A second portion of the plurality of pixel circuits individually includes an event vision sensor (EVS) photodiode. The plurality of binning transistors is configured to bin together at least one of the first portion or the second portion.
An imaging sensor comprising:
A method comprising:
An electronic device comprising:
Dependencies are inferred from the claim text.