Multi-layer metallization for multi-channel emitter array

An optical chip, comprising:

• a first channel comprising a first set of emitters;
• a first set of contacts for the first set of emitters;
• a first dielectric layer;
• a first metallization layer on the first set of contacts and the first dielectric layer,
• wherein the first metallization layer comprises a first interchannel portion positioned between the first set of emitters and a second set of emitters;
• a second channel comprising the second set of emitters,
• wherein the second channel is substantially parallel to the first channel;
• a second set of contacts for the second set of emitters;
• a second dielectric layer on the first metallization layer and the first dielectric layer;
• and
• a second metallization layer on the second set of contacts and the second dielectric layer,
• wherein the second metallization layer comprises a second interchannel portion positioned between the first set of emitters and the second set of emitters, and
• wherein the second interchannel portion of the second metallization layer at least partially overlaps the first interchannel portion of the first metallization layer.

A time-of-flight system, comprising:

• an array of emitters to emit optical beams into a field of view,
• wherein the array of emitters comprises:
• a first channel comprising a first set of emitters,
• a second channel comprising a second set of emitters,
• wherein the second channel is substantially parallel to the first channel,
• a first metallization layer to provide electrical contact between a drive circuit and the first set of emitters,
• a dielectric layer on the first metallization layer, and
• a second metallization layer, on the dielectric layer, to provide electrical contact between the drive circuit and the second set of emitters,
• wherein the second metallization layer at least partially overlaps with the first metallization layer;
• the drive circuit;
• and
• a receiver to receive light reflected from the field of view.