Light-emitting packaging device
AssigneeQuanzhou Sanan Semiconductor Technology Co., Ltd.
InventorsJunpeng Shi, Qiuxia Lin, Weng-Tack Wong, Changchin Yu
Life of this patent
Estimating the term…
Abstract
A light-emitting packaging device includes a substrate, a light-emitting diode (LED) chip, an optical element, and a covering member. The LED chip is disposed on the substrate. The optical element is spacedly disposed on the LED chip opposite to the substrate, and has an upper surface and a lower surface that are respectively distal from and proximal to the LED chip. The covering member is made from a fluorine-containing resin, and is configured to cover the LED chip and at least a portion of the upper surface of the optical element.
Claims22
A light-emitting packaging device, comprising:
- a substrate;
- a light-emitting diode (LED) chip disposed on said substrate;
- an optical element spacedly disposed on said LED chip opposite to said substrate, and having an upper surface and a lower surface that are respectively distal from and proximal to said LED chip;
- and
- a covering member made from a fluorine-containing resin, and being configured to cover said LED chip and at least a portion of said upper surface of said optical element,
- wherein said substrate is formed with a recess, said recess being defined by a recess-defining wall that has a bottom wall and a surrounding wall extending upwardly from said bottom wall, said covering member being configured to further fill a portion of said recess that is beneath said lower surface of said optical element,
- wherein said surrounding wall of said recess-defining wall and said upper surface of said optical element cooperatively define a gap, said covering member being configured to further fill said gap, and
- wherein said light-emitting packaging device further includes a platform unit protruding upwardly from said bottom wall and along said surrounding wall, said optical element being supported by said platform unit.
A light-emitting packaging device, comprising:
- a substrate;
- a light-emitting diode (LED) chip disposed on said substrate;
- an optical element spacedly disposed on said LED chip opposite to said substrate, and having an upper surface and a lower surface that are respectively distal from and proximal to said LED chip;
- and
- a covering member made from a fluorine-containing resin, and being configured to cover said LED chip and at least a portion of said upper surface of said optical element,
- wherein said fluorine-containing resin of said covering member is represented by the following formula:
- wherein a percentage of n to (n+m) ranges from 40% to 60%.
Dependencies are inferred from the claim text.