Embedded wafer level optical sensor packaging

A device, comprising:

• a semiconductor substrate having a first surface, a second surface opposite to the first surface, one or more first sidewalls extending from the first surface to the second surface and being transverse to the first and second surfaces, an opening extending fully through the semiconductor substrate from the first surface to the second surface, and the one or more first sidewalls surround the opening;
• a light sensor embedded in the semiconductor substrate at a first portion of the first surface;
• a light emitter die embedded in the semiconductor substrate and within the opening, the light emitter die includes one or more second sidewalls that are spaced inward from the one or more first sidewalls, the light emitter die is at a second portion of the first surface spaced apart from the first portion of the first surface, the light emitter die includes a third surface and an emitter at the third surface facing away from the second surface of the semiconductor substrate;
• an optically non-transmissive resin embedded in the semiconductor substrate and in the opening, the optically non-transmissive resin positioned on the one or more second sidewalls of the light emitter and the one or more first sidewalls of the semiconductor substrate, and the optically non-transmissive resin extends from the first surface of the semiconductor substrate to the second surface of the semiconductor substrate, and the optically non-transmissive resin includes a fourth surface that is adjacent to the third surface and faces away from the second surface of the semiconductor substrate;
• and
• an optically transmissive structure on the third surface of the light emitter and on the fourth surface of the optically non-transmissive resin.

A device, comprising:

• a semiconductor substrate having a first surface and a second surface opposite to the first surface;
• an opening in the semiconductor substrate that extends fully through the semiconductor substrate from the first surface to the second surface;
• at least one first sidewall of the semiconductor substrate delimits the opening;
• a light emitter within the opening including at least one second sidewall and a third surface transverse to the at least one second sidewall and at the first surface of the semiconductor substrate;
• an optically non-transmissive resin within the opening and extending fully through the opening, the optically non-transmissive resin covers the at least one first sidewall and covers the at least one second sidewall, the optically non-transmissive resin including a fourth surface that surrounds the third surface of the light emitter;
• and
• a first optically transmissive portion on the third surface of the light emitter, on the fourth surface of the optically non-transmissive resin, and on the first surface of the semiconductor substrate, the first optically transmissive portion including one or more sidewalls transverse to the first surface of the semiconductor substrate, and the first optically transmissive portion includes a fifth surface spaced apart from the first surface, the third surface, and the fourth surface, and facing away from the first surface, the third surface, and the fourth surface.