Shielded integrated device packages

A sensor module comprising:

• an integrated device package comprising:
• a package substrate comprising an insulating substrate with conductive routing traces, the package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor substrate of the sensor module;
• a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side;
• and
• an integrated device die attached to the radiation shield by way of a second adhesive, the integrated device die comprising sensitive active electronic circuitry in a sensitive active region of the integrated device die, wherein the integrated device die is configured to process signals transmitted to the integrated device die from the sensor substrate by way of the plurality of contact pads, and wherein the integrated device die is configured to transmit the processed signals to an external device by way of the plurality of contact pads;
• a heat spreader disposed over the integrated device package, the heat spreader configured to convey heat from components of the sensor module;
• and
• a connector mounted to the sensor substrate, the connector laterally offset from the integrated device package along the sensor substrate and extending outwardly from the sensor substrate in a direction towards the heat spreader,
• wherein the sensor module is configured such that all processed signals that are transferred between the integrated device die and the external device are transferred along an electrical pathway extending from the integrated device die, through the plurality of contact pads, to the sensor substrate, and from the sensor substrate to the external device through the connector mounted to the sensor substrate;
• and
• wherein the heat spreader comprises a recess along a side portion of the heat spreader, the connector extending through the recess of the heat spreader.

A sensor module comprising:

• an integrated device package comprising an integrated device die and a radiation shield;
• a sensor assembly comprising a sensor substrate and a sensor die mounted to a front side of the sensor substrate;
• a heat spreader disposed over the integrated device package, the heat spreader configured to convey heat from components of the sensor module;
• and
• an electrical connector on a back side of the sensor substrate, the electrical connector configured to electrically connect to an external device, wherein the integrated device package is electrically connected to the electrical connector through the sensor substrate;
• and
• wherein the electrical connector is laterally offset from the integrated device package along the sensor substrate and extending outwardly from the sensor substrate in a direction towards the heat spreader, and
• wherein, during operation of the sensor module, signals are transferred between the integrated device package and the external device along an electrical pathway extending from the integrated device die to the sensor substrate, and from the sensor substrate to the external device through the electrical connector on the back side of the sensor substrate;
• and
• wherein the heat spreader comprises a recess along a side portion of the heat spreader, the electrical connector extending through the recess of the heat spreader.