Image sensor package

An image sensor package comprising:

• a solder resist layer that wraps around a redistribution layer and a connection pad;
• a mold layer disposed on the solder resist layer and including an inner wall and an outer wall opposite to the inner wall, the inner wall of the mold layer defining a sensor array region;
• an image sensor chip disposed on the solder resist layer and in the sensor array region, and contacting the mold layer;
• a transparent substrate spaced apart from the image sensor chip in a first direction;
• and
• an adhesive layer disposed between the transparent substrate and the mold layer,
• wherein the mold layer includes a third face and a fourth face that are opposite to each other and that connect the inner wall of the mold layer and the outer wall of the mold layer, and
• the fourth face of the mold layer does not overlap the image sensor chip in the first direction.

An image sensor package comprising:

• an image sensor chip including:
• a first face on which a redistribution layer is formed and a second face that is opposite to the first face and on which a photoelectric conversion layer is formed;
• and
• side walls that connect the first and second faces;
• a solder resist layer disposed on the first face of the image sensor chip and that wraps around the redistribution layer and a connection pad on the redistribution layer;
• a mold layer disposed on the side walls of the image sensor chip and including:
• a third face disposed on a same plane as the first face of the image sensor chip;
• and
• a fourth face opposite to the third face;
• a transparent substrate disposed on the second face of the image sensor chip and spaced apart from the image sensor chip in a first direction, the transparent substrate including a first portion that overlaps the image sensor chip in the first direction and a second portion that does not overlap the image sensor chip in the first direction;
• an adhesive layer disposed between the second portion of the transparent substrate and the fourth face of the mold layer;
• and
• a solder bump disposed on the connection pad and electrically connected to the redistribution layer and the connection pad,
• wherein the image sensor chip includes:
• a first substrate layer including a through electrode;
• and
• a second substrate layer disposed on the first substrate layer and including the photoelectric conversion layer,
• wherein the through electrode penetrates the first substrate layer and electrically connects the redistribution layer and the photoelectric conversion layer,
• wherein the side walls of the image sensor chip overlap the mold layer in a second direction intersecting the first direction, and
• wherein the fourth face of the mold layer does not overlap the first substrate layer in the first direction.