LED device and light emitting apparatus including the same

An LED device comprising:

• a plurality of LED chips, each of said LED chips having opposite first and second surfaces, and a side surface that is connected between said first and second surfaces, and including a semiconductor stack having a first-type semiconductor layer, a second-type semiconductor layer, and a light-emitting layer located between the first semiconductor layer and the second semiconductor layer, and an electrode assembly disposed on the semiconductor stack and including a first electrode and a second electrode, wherein the first electrode is electrically connected to the first semiconductor layer, and the second electrode is electrically connected to the second semiconductor layer;
• an electric circuit layer assembly disposed on said second surfaces of said LED chips, and having opposite first and second surfaces and a side surface that is connected between said first and second surfaces of said electric circuit layer assembly, said first surface of said electric circuit layer assembly being directly and electrically connected to said first and second electrodes of said electrode assembly;
• and
• an encapsulating layer enclosing said LED chips and said electric circuit layer assembly in such a manner that at least a portion of said second surface of said electric circuit layer assembly is exposed from said encapsulating layer,
• wherein an area of said first surface of said electric circuit layer assembly is greater than an area of said second surfaces of said LED chips.

An LED device comprising:

• a plurality of LED chips, each of said LED chips having opposite first and second surfaces, and a side surface that is connected between said first and second surfaces, and including a semiconductor stack having a first-type semiconductor layer, a second-type semiconductor layer, and a light-emitting layer located between the first semiconductor layer and the second semiconductor layer, and an electrode assembly disposed on the semiconductor stack and including a first electrode and a second electrode, wherein the first electrode is electrically connected to the first semiconductor layer, and the second electrode is electrically connected to the second semiconductor layer;
• an electric circuit layer assembly disposed on said second surfaces of said LED chips, and having opposite first and second surfaces and a side surface that is connected between said first and second surfaces of said electric circuit layer assembly, said first surface of said electric circuit layer assembly being directly and electrically connected to said first and second electrodes of said electrode assembly;
• and
• an encapsulating layer enclosing said LED chips and said electric circuit layer assembly in such a manner that at least a portion of said second surface of said electric circuit layer assembly is exposed from said encapsulating layer,
• wherein said encapsulating layer has opposite upper and lower surfaces, said upper surface of said encapsulating layer being flush with said first surface of each of said LED chips, said lower surface of said encapsulating layer being flush with said second surface of said electric circuit layer assembly.

An LED device comprising:

• a plurality of LED chips, each of said LED chips having opposite first and second surfaces, and a side surface that is connected between said first and second surfaces, and including a semiconductor stack having a first-type semiconductor layer, a second-type semiconductor layer, and a light-emitting layer located between the first semiconductor layer and the second semiconductor layer, and an electrode assembly disposed on the semiconductor stack and including a first electrode and a second electrode, wherein the first electrode is electrically connected to the first semiconductor layer, and the second electrode is electrically connected to the second semiconductor layer;
• an electric circuit layer assembly disposed on said second surfaces of said LED chips, and having opposite first and second surfaces and a side surface that is connected between said first and second surfaces of said electric circuit layer assembly, said first surface of said electric circuit layer assembly being directly and electrically connected to said first and second electrodes of said electrode assembly;
• and
• an encapsulating layer enclosing said LED chips and said electric circuit layer assembly in such a manner that at least a portion of said second surface of said electric circuit layer assembly is exposed from said encapsulating layer,
• wherein said encapsulating layer includes a first encapsulating sub-layer and a second encapsulating sub-layer, said first encapsulating sub-layer covering said LED chips in such a manner that said first surface of each of said LED chips is exposed from said first encapsulating sub-layer, said second encapsulating sub-layer covering said electric circuit layer assembly in such a manner that at least a portion of said second surface of said electric circuit layer assembly is exposed from said second encapsulating sub-layer.