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US 12,002,793 B2Granted
Integrating system in package (SiP) with input/output (IO) board for platform miniaturization
AssigneeIntel Corporation
InventorsEng Huat Goh, Wee Hoe, Khang Choong Yong, Ping Ping Ooi
Life of this patent
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Abstract
Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.
Claims8
A computing system comprising:
- a processor having one or more processor cores;
- a volatile memory coupled to the processor to store data to be processed by the processor;
- a System in Package (SiP) board, wherein the SiP board comprises a plurality of logic components, wherein the plurality of logic components comprises the processor and the volatile memory;
- and
- an Input Output (IO) board coupled to the SiP board via a grid array,
- wherein the plurality of logic components is to be provided on both a first side and a second side of the SiP board, wherein one or more of the plurality of logic components are to be positioned in an opening in the IO board, wherein the opening in the IO board is to be formed by a location of one or more components of the SiP board, wherein at least one flexible cable is to couple a first logic component of the plurality of logic components on the first side of the SiP board to a second logic component of the plurality of logic components on the second side of the SiP board, wherein a non-volatile memory is to be mounted to the IO board.
3 more elements
Dependencies are inferred from the claim text.