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US 12,002,787 B2Granted
Multi-die package structure and multi-die co-packing method
AssigneeChengdu Monolithic Power Systems Co., Ltd.
InventorsYingjiang Pu, Hunt Jiang
Life of this patent
Estimating the term…
Abstract
A multi-die package structure with an embedded die embedded in a substrate, a flip chip die mounted above the substrate, and an attached die attached onto the flip chip die. The package is compact and low cost.
Claims12
A multi-die package structure, comprising:
- a first die embedded in a substrate;
- a second die mounted above the substrate, the second die being electrically coupled to the substrate by way of a conductor;
- and
- a third die attached onto the second die, the third die being configured to contact with the substrate by way of a bonding wire.
1 more element
A multi-die co-packed chip, comprising:
- an input pin, electrically coupled to a first die on which a high side power switch is fabricated;
- a switch pin, electrically coupled to the first die and a second die on which a low side power switch is fabricated;
- a ground pin, electrically coupled to the second die;
- and
- a control pin, electrically coupled to a third die on which a control circuit is fabricated;
- wherein any one of the first die, the second die or the third die is embedded in a substrate as an embedded die;
- and
- wherein either one of the remaining two dies is mounted above the substrate as a flip chip die;
- and
- the remaining die is attached onto the flip chip die as an attached die.
7 more elements
A multi-die co-packing method, comprising:
- embedding a first die in a substrate, the substrate having multiple metal layers;
- mounting a second die over the substrate;
- attaching a third die onto the second die;
- electrically coupling the first die to the second die and the substrate by way of a conductor;
- and electrically coupling the third die to the substrate by way of a bonding wire;
- and
- molding the first die, the second die, the third die, and the substrate as a package.
4 more elements
Dependencies are inferred from the claim text.