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US 12,002,780 B2Granted
Package structure including a base and a lid disposed over the base and method of forming the package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorKuei-Sung Chang
Life of this patent
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Abstract
The present disclosure provides a package structure. The package structure includes a base, a device disposed on the base, a lid disposed over the base and the device and spaced apart from the device, and a first metal component disposed between the device and the lid, wherein the first metal component contacts the device and the lid. The present disclosure also provides a method for forming a package structure.
Claims20
A package structure, comprising:
- a base;
- a device disposed on the base and having a top surface;
- a lid disposed over the base and the device, spaced apart from the device, and having an interior surface facing to the top surface;
- a first metal component disposed between the top surface and the interior surface, and free of surrounding material, wherein a surface of the first metal component is tapered from the top surface towards the interior surface, or tapered from the interior surface towards the top surface, an upper surface of the first metal component is separated from the interior surface, a lower surface of the first metal component contacts the top surface;
- and
- a second metal component disposed between the device and the lid, wherein the second metal component contacts the interior surface and the top surface.
3 more elements
A package structure, comprising:
- a base;
- a first device disposed on the base;
- a second device disposed on the first device;
- a lid disposed over the base, the first device and the second device, and spaced apart from the first device and the second device;
- a first metal component disposed between the first device and the lid,
- wherein the first metal component contacts the lid and the first device, is free of surrounding material and vertically extends between the first device and the lid, and
- the first metal component has a height substantially greater than a thickness of the second device;
- and
- a second metal component disposed on the second device, wherein the second metal component is separated from the lid.
6 more elements
A method, comprising:
- providing a base and a device disposed on the base;
- disposing a first metal component over the device, wherein the first metal component is free of surrounding material;
- disposing a second metal component over the device and adjacent to the first metal component;
- disposing a lid over the base and the device to contact the first metal component, wherein
- an upper surface of the first metal component is separated from an interior surface of the lid,
- a lower surface of the first metal component contacts a top surface of the device,
- and the second metal component contacts the interior surface and the top surface;
- and
- deriving a distance based on a first height of the second metal component, wherein
- a surface of the first metal component tapers from a top surface of the device towards an interior surface of the lid, or tapers from the interior surface towards the top surface.
7 more elements
Dependencies are inferred from the claim text.