Interconnect structure and method for forming the same

An interconnect structure comprising:

• a plurality of first pads arranged to form a first array, wherein the first array has a first row, a second row and an mth row extending along a first direction and parallel to each other along a second direction, wherein the first pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction, m is an integer equal to or greater than 2, and n is an integer equal to or greater than 2;
• a plurality of second pads arranged to form a second array, wherein the second array has a first row, a second row and an mth row extending along the first direction and parallel with each other along the second direction, wherein the second pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction;
• and
• a plurality of first conductive lines disposed in a first layer, a plurality of second conductive lines disposed in a second layer and a plurality of nth conductive lines disposed in an nth layer, wherein the first layer, the second layer and the nth layer are stacked to form a multi-layered structure,
• wherein the first pads and the second pads are disposed over the first layer, the second layer and the nth layer,
• wherein each of the first pads in the first row in the first group of the first array is electrically connected to one of the second pads in the first row in the first group of the second array by one of the first conductive lines in the first layer and electrically isolated from the second pads in the second group and the nth group, the first pads in the first row in the first group of the first array are electrically isolated from the first pads in other rows in the first group of the first array, and the second pads in the first row in the first group of the second array are electrically isolated from the second pads in other rows in the first group of the second array,
• wherein each of the first pads in the second row in the first group of the first array is electrically connected to one of the second pads in the second row in the first group of the second array by one of the first conductive lines in the first layer and electrically isolated from the second pads in the second group and the nth group, the first pads in the second row in the first group of the first array are electrically isolated from the first pads in other rows in the first group of the first array, and the second pads in the second row in the first group of the second array are electrically isolated from the second pads in other rows in the first group of the second array, and
• wherein each of the first pads in the mth row in the first group of the first array is electrically connected to one of the second pads in the mth row in the first group of the second array by one of the first conductive lines in the first layer and electrically isolated from the second pads in the second group and the nth group, the first pads in the mth row in the first group of the first array are electrically isolated from the first pads in other rows in the first group of the first array, and the second pads in the mth row in the first group of the second array are electrically isolated from the second pads in other rows in the first group of the second array.

An interconnect structure comprising:

• a plurality of first pads arranged to form a first array in a first layer, a second layer and an nth layer, wherein each of the first arrays has a first row, a second row and an mth row extending along a first direction and parallel to each other along a second direction, wherein the first pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction, m is an integer equal to or greater than 2, and n is an integer equal to or greater than 2;
• a plurality of second pads arranged to form a second array in the first layer, the second layer and the nth layer, wherein each of the second arrays has a first row, a second row and an mth row extending along the first direction and parallel with each other along the second direction, wherein the second pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction;
• and
• a plurality of first conductive lines disposed in the first layer, a plurality of second conductive lines disposed in the second layer and a plurality of nth conductive lines disposed in the nth layer, wherein the first layer, the second layer and the nth layer are stacked to form a multi-layer,
• wherein the first pads in adjacent rows in each of the first arrays in each of the first layer, the second layer and the nth layer are separated from each other by a first vertical distance, the second pads in adjacent rows in each of the second arrays in each of the first layer, the second layer and the nth layer are separated from each other by a second vertical distance,
• wherein a sum of widths of the first conductive lines electrically connecting the first pads and the second pads in the same row in the first layer is less than the first vertical distance and the second vertical distance from a plan view, a sum of widths of the second conductive lines electrically connecting the first pads and the second pads in the same row in the second layer is less than the first vertical distance and the second vertical distance from the plan view, and a sum of widths of the nth conductive lines electrically connecting the first pads and the second pads in the same row in the nth layer is less than the first vertical distance and the second vertical distanced structure from the plan view.