High density organic bridge device and method

A microelectronic package, comprising:

• a first die coupled to a substrate;
• a second die coupled to the substrate adjacent to the first die;
• an organic polymer interconnect bridge located beneath the first and second die, and above the substrate, wherein an organic polymer in the organic polymer interconnect bridge electrically separates two or more conductive paths that directly connect the first die to the second die, the organic polymer bridge electrically coupled between an edge of the first die and an edge of the second die.

A microelectronic package, comprising:

• a first die coupled to a substrate;
• a second die coupled to the substrate adjacent to the first die;
• an organic polymer interconnect bridge at least partially embedded in the substrate, wherein an organic polymer in the organic polymer interconnect bridge electrically separates two or more conductive paths that directly connect the first die to the second die, the organic polymer bridge electrically coupled between an edge of the first die and an edge of the second die.