Chip package structure with metal-containing layer

A chip package structure, comprising:

• a first wiring substrate comprising a substrate, a first pad, a second pad, and an insulating layer, wherein the first pad and the second pad are respectively over a first surface and a second surface of the substrate, and the insulating layer partially covers the first pad;
• a conductive protection element covering the first pad, wherein a bottommost end of the conductive protection element is closer to the first pad than a bottommost surface of the insulating layer, and the conductive protection layer comprises tin;
• a metal-containing layer between the first pad and the conductive protection element, wherein the conductive protection element and the metal-containing layer are made of different materials;
• a chip bonded to the second pad;
• and
• a second wiring substrate, wherein the first wiring substrate is over the second wiring substrate, the second wiring substrate comprises a second substrate and a resilient contact structure mounted to the second substrate, and the resilient contact structure is electrically connected to the conductive protection element.

A chip package structure, comprising:

• a first wiring substrate comprising a substrate, a first pad, a second pad, and an insulating layer, wherein the first pad and the second pad are respectively over a first surface and a second surface of the substrate, and the insulating layer partially covers the first pad;
• a tin-containing protection element covering the first pad, wherein the tin-containing protection element is thinner than the insulating layer;
• a metal-containing layer between the tin-containing protection element and the first pad;
• a chip bonded to the second pad;
• and
• a second wiring substrate, wherein the first wiring substrate is over the second wiring substrate, the second wiring substrate comprises a second substrate and a contact structure mounted to the second substrate, the contact structure is electrically connected to the tin-containing protection element, and the contact structure penetrates into the tin-containing protection element.